Journal publications

 

2020

K. Piotrowska, R. Ambat, “Residue-assisted water layer build-up under transient climatic conditions and failure occurrence in electronics”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 99 (2020) pp. 1-1.
K. Piotrowska, F. Li, R. Ambat, “Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability”, Soldering and Surface Mount Technology, 32 (2020) pp. 93-103.
A. Khangholi, F. Li, K. Piotrowska, S. Loulidi, R. Ambat, G. Van Assche, A. Hubin, I. De Graeve, “Humidity Robustness of Plasma-Coated PCBs”, Journal of Electronic Materials, 49 (2020) 848-860, DOI: 10.1007/s11664-019-07714-5

2019 

K. Piotrowska, F. Li, R. Ambat, “Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability”, Soldering and Surface Mount Technology, 2019, DOI: 10.1108/ssmt-05-2019-0020
S. Joshy, V. Verdingovas, M.S. Jellsen, R. Ambat, “Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations”, Microelectronics and Reliability, 93 (2019) 81-88, DOI:10.1016/j.microrel.2018.12.010
K. Piotrowska, M. Grzelak, R. Ambat, “No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics”, Journal of Electronic Materials, 48 (2019) 1207-1222, DOI: 10.1007/s11664-018-06862-4 

2018 

K. Piotrowska, V. Verdingovas, and R. Ambat, “Humidity-related failures in electronics: effect of binary mixtures of weak organic acid activators,” J. Mater. Sci. Mater. Electron., vol. 29, no 20 pp. 17834–17852, 2018.
K. Piotrowska, R. Ud Din, F. B. Grumsen, M. S. Jellesen, and R. Ambat, “Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics,” J. Electron. Mater., vol. 47, no. 7, pp. 4190–4270, 2018.
K. Piotrowska, M. S. Jellesen, and R. Ambat, “Water film formation on the PCBA surface and failure occurrence in electronics,” Proceedings 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2018), pp. 72–76, 2018.

2017

V. Verdingovas, S. Joshy, M. S. Jellesen, and Rajan Ambat, "Analysis of surface insulation resistance related failures in electronics by circuit simulation," Circuit World, vol. 43 no. 2, pp. 45–55, 2017
V. C. Gudla and R. Ambat, “Corrosion failure analysis of hearing aid battery-spring contacts,” Eng. Fail. Anal., vol. 79, pp. 980–987, 2017.
K. Piotrowska, M. S. Jellesen, and R. Ambat, “Thermal decomposition of solder flux activators under simulated wave soldering conditions,” Solder. Surf. Mt. Technol.., vol. 29, no. 3, pp. 133–143, 2017.
H. Conseil-Gudla, Z. Staliulionis, M. S. Jellesen, M. Jabbari, J. H. Hattel, and R. Ambat, “Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions,” IEEE Trans. Components, Packag. Manuf. Technol., vol. 7, no. 3, pp. 412–423, 2017.
V. Verdingovas, M. S. Jellesen, and R. Ambat, “Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards,” Microelectron. Reliab., vol. 73, pp. 158–166, 2017.

2016

H. Conseil, M. S. Jellesen, and R. Ambat, “Printed circuit board surface finish and effects of chloride contamination, electric field, and humidity on corrosion reliability,” J. Electron. Mater.,  vol 46, no 2, pp. 817-825, 2016.
H. Conseil, V. C. Gudla, M. S. Jellesen, and R. Ambat, “Humidity build-up in a typical electronic enclosure exposed to cycling coditions and effect on corrosion reliability,” IEEE Trans. Components, Packag, Manuf. Technol., vol. 6, no. 9, pp. 1379–1388, 2016.

2015

H. Conseil, V. Verdingovas, M. S. Jellesen, and R. Ambat, “Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics,” J. Mater. Sci. Mater. Electron., vol. 27, no 1, pp. 23-32, 2015.
V. Verdingovas, L. Müller, M. S. Jellesen, F. B. Grumsen, and R. Ambat, “Effect of iodine on the corrosion of Au-Al wire bonds,” Corros Sci., vol. 97, pp. 161–171, 2015.
V. Verdingovas, M. S. Jellesen, and R. Ambat, “Relative effect of solder flux chemistry on the humidity related failures in electronics,” Solder. Surf. Mt. Technol., vol. 27, no. 4, pp. 157–163, 2015.
V. Verdingovas, M. S. Jellesen, and R. Ambat, “Effect of pulsed voltage on electrochemical migration in electronics,” J. Mater. Sci. Mater. Electron., vol. 26, no. 10, pp. 7997–8007, 2015.
V. Verdingovas, M. S. Jellesen, and R. Ambat, “Solder flux residues and humidity-related failures in electronics: relative effects of weak organic acid used in no-clean flux systems,” J. Electron. Mater., vol. 14, no. 4, pp. 1116–1127, 2015.

2014

V. Verdingovas, M. S. Jellesen, and R. Ambat, “Impact of NaCl contamination and climatic conditions on the reliability of printed circuit board assemblies,” IEEE Trans. Device Mater. Reliab., vol. 14, no. 1, pp. 42–51, 2014.
J. B. Jacobsen, J. P. Krog, A. H. Holm, L. Rimestad, and A. Riis, “Climate-Protective Packaging: Using basic physics to solve climatic challenges for electronics in demanding applications,” IEEE Ind. Electron. Mag., vol. 8, no. 3, pp. 51–59, 2014.
H. Conseil, M. Stendahl Jellesen, and R. Ambat, “Contamination profile on typical printed circuit board assemblies vs soldering process,” Solder. Surf. Mt. Technol., vol. 26, no. 4, pp. 194–202, Aug. 2014.
R. Ambat, “Climatic Reliability of Electronic Devices and Components,” SMT Surf. Mt. Technol. Mag., vol. 29, no. 4, pp. 12–28, 2014.

2013

V. Verdingovas, M. S. Jellesen, and R. Ambat, “Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components,” Corros. Eng. Sci. Technol., vol. 48, no. 6, pp. 426–435, Sep. 2013.
U. Rathinavelu, M. S. Jellesen, R. Ambat, "Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies," Corros. Eng. Sci. Technol., vol. 48, no. 6, pp. 436–444, Sep. 2013.
O. V. Elisseeva, A. Bruhn, J. Cerezo, A. Mavinkurve, R. T. H. Rongen, G. M. O'Halloran, R. Ambat, H. Terryn, J. M. C. Mol, "Novel electrochemical approach to study corrosion mechanism of Al–Au wire–bond pad interconnections," Corros. Eng. Sci. Technol., vol. 48, no. 6, pp. 409–417, Sep. 2013.

2012

U. Rathinavelu, M. S. Jellesen, P. Moller, and R. Ambat, “Effect of No-Clean Flux Residues on the Performance of Acrylic Conformal Coating in Aggressive Environments,” IEEE Trans. Components, Packag. Manuf. Technol., vol. 2, no. 4, pp. 719–728, 2012.

2011

D. Minzari, M. S. Jellesen, P. Møller, and R. Ambat, “On the electrochemical migration mechanism of tin in electronics,” Corros. Sci., vol. 53, no. 10, pp. 3366–3379, Oct. 2011.
D. Minzari, M. S. Jellesen, P. Møller, and R. Ambat, “Morphological study of silver corrosion in highly aggressive sulfur environments,” Eng. Fail. Anal., vol. 18, no. 8, pp. 2126–2136, Dec. 2011.
D. Minzari, F. B. Grumsen, M. S. Jellesen, P. Møller, and R. Ambat, “Electrochemical migration of tin in electronics and microstructure of the dendrites,” Corros. Sci., vol. 53, no. 5, pp. 1659–1669, May 2011.

2010

M. S. Jellesen, D. Minzari, U. Rathinavelu, P. Møller, and R. Ambat, “Corrosion failure due to flux residues in an electronic add-on device,” Eng. Fail. Anal., vol. 17, no. 6, pp. 1263–1272, Sep. 2010.
M. S. Jellesen, D. Minzari, U. Rathinavelu, P. Møller, and R. Ambat, “Investigation of electronic corrosion at device level,” Electrochem. Soc., vol. 25, no. 30, pp. 1–14, 2010.

2009

D. Minzari, M. S. Jellesen, P. Møller, P. Wahlberg, and R. Ambat, “Electrochemical Migration on Electronic Chip Resistors in Chloride Environments,” IEEE Trans. Device Mater. Reliab., vol. 9, no. 3, pp. 392–402, 2009.
V. Chidambaram, J. Hald, R. Ambat, and J. Hattel, “A corrosion investigation of solder candidates for high-temperature applications,” Jom, vol. 61, no. 6, pp. 59–65, Jun, 2009.

2008

 M. S. Jellesen, P. Westermann, U. Rathinavelu, D. Minzari, P. Moller, R. Ambat, “Technical article: Corrosion in electronics," Corrosion Management, September/October, pp. 17–22, 2008.

2007

 R. Ambat and P. Møller, “Corrosion investigation of material combinations in a mobile phone dome–key pad system,” Corros. Sci., vol. 49, no. 7, pp. 2866–2879, Jul, 2007