CRED was established in 2024 as a novel research initiative under CELCORR using funding from Poul Due Jensens Foundation (PDJF), is dedicated to addressing the corrosion reliability and robustness requirements of high voltage electronics today. The project places a particular emphasis on high voltage/power electronics as they are increasingly exposed to harsh conditions such as in renewable energy systems and electrification, among others. Centre will also focus on changing scenario in relation of exposure conditions such as effect of gaseous in conjunction with humidity. It will explore factors that could be manipulated to enhance intrinsic robustness from materials and corrosion point, however with the aim of those factors enhancing functional performance and robustness of Power electronics components, devices, and systems. Programme will also involve establishment of laboratory facilities for testing under humid and gaseous conditions, such as H2S and SO2, and for high voltage testing from corrosion point of view.
“CELCORR’s unique strength is materials and corrosion expertise, and we are applying this to develop environmentally robust designs by understanding design elements that are causing failures and elucidating mechanisms. The CRED project will greatly enhance this capability.”
Research questions CRED project intended to focus on:
Centre for Climate Robust Electronics design (CRED)
Research projects under CRED
- Effect of increasing voltage/power and climate conditions (RH,T) on corrosion failure mechanisms such as ECM, Anodic migration (AM) and CAF, and combinations.
- Synergistic effect of multi-gas-humidity conditions and voltage/power on corrosion failure mechanisms such as ECM, AM, and CAF, and how it influence device functionality and performance.
- Understanding moisture/gas transport through polymer packaged interface resulting in corrosion failures: experimental investigation of material and interfaces synergistic with voltage/power,and how to make robust design e.g. IGBT Gel-Substrate interface, multilayer PCBA.
- Numerical Multiphysics modelling of moisture/gas transport through polymer packages and interfaces to develop digital twin model for packaging eg. IGBT gel-substrate interface, Multilayer PCBA.
- Design of high voltage-based test elements and PCB surfaces mimicking standard high voltage parts for controlled corrosion testing with the aim of developing robust design elements and surfaces resisting.
- Developing safe-design guidelins for high voltage layout design using experimental and electrochemical modelling tools e.g. creepage distances and guidelines.
- Setting up state-of-the-art lab facilities and developing suitable failure analysis methodology.
- Building open easily accessible knowledge platform based on project outcome.