PCBA design strategies for increasing intrinsic humidity robustness and developing predictive measures 


 PhD student: Anish Rao Lakkaraju

This PhD project is part of the ELMAC consortium on “Electronics Manufactured for Climate” and Corecon industrial consortium. PhD project aims for detailed investigation of humidity interaction with PCBA surface and the effect of PCBA design in correlation with the electrochemical processes leading to failures. Research work focus on understanding influence of various PCBA parameters together with process aspects in determining the water layer formation under humid conditions and how the water layer formation leading to electrical failures due to electrochemical process. Simultaneously, the profiling of humidity/temperature on the PCBA surface will be correlated to failure sequences. Broadly, the work in the project will include:

• Developing test PCBA boards incorporating various PCBA design elements with and without components suitable for investigation. From the process side, reflow and wave soldering processes will be simulated.

• DC electrochemical methods and AC impedance techniques will be used for measuring the humidity effects individually or together. Various humidity levels and condensation regimes (defining water film build up) will be tested. For condensation experiments, special cooling/heating stages will be used including in-situ visualization of water film formation and failure development.


Expected final outcome will be detailed understanding of the PCBA design aspects to humidity related failures, and defining safe boundary design elements. 

Source of Funding:

CELCORR/CreCon Industrial consortium

Industrial Collaborators:

Danfoss, Grundfos, Vestas, Eltek, Widex, Inventec, Wevo, Volvo, Maganlytix