Conference proceedings

Using Predictive Analytics Approaches to Investigate Climatic Reliability and Humidity Robustness issues of PCBA under Different Conditions Bahrebar, S. & Ambat, R., 2023, Proceedings of the 33rd European Safety and Reliability Conference. P. Brito, M., Aven, T., Baraldi, P., Čepin, M. & Zio, E. (eds.). Research Publishing Services, p. 2701-2702
Probability of Failure due to Electrochemical Migration on Surface Mount Capacitor under Electrolyte Condition with same Contamination and Conductivity Level Bahrebar, S. & Ambat, R., 2023, 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). IEEE, p. 1-9

K. Piotrowska, S. Lagana, M.S. Jellesen, R. Ambat, "Impact of process-related flux contamination on the electronics reliability issues under detrimental climatic conditions", Proceedings of SMTA Pan Pacific Microelectronics Symposium 2019, 11-14.02.2019 Kauai, HI, USA. 
I. Mantis, F. Li, V. Verdingovas, R. Ambat, M.S. Jellesen, “Humidity barrier properties of coatings used to protect electronics against corrosion”, NordPac 2019, IMAPS Nordic seminar, DTU Lyngby, Denmark, 11-13 June 2019.
F. Li, K. Piotrowska, M.S. Jellesen, R. Ambat, “Electrochemical study on etching ability and humidity robustness of organic amines used in the solder flux systems”, NordPac 2019, IMAPS Nordic seminar, DTU Lyngby, Denmark, 11-13 June 2019.
L.H. Hansen, A. Yadav, R. Ambat, M.S. Jellesen, “Investigation of materials for low load electrical contacts”, NordPac 2019, IMAPS Nordic seminar, DTU Lyngby, Denmark, 11-13 June 2019.
R. Ambat, “Water film formation on PCBA surface and humidity robustness of electronics”, SMTA Europe conference on “Electronics in Harsh Environments”, Amsterdam, Netherland, 2-4 April 2019.
L. Simone, R. Theresia, V. Verdingovas, R. Ambat, “ Electrochemical Impedance Spectroscopy (EIS) for monitoring the water load on PCBAs under cycling condensing conditions to predict electrochemical migration under DC loads”, Proceedings of the 69^th Electronic components and technology conference, Las Vegas, USA, May 28-31, 2019.

L. Simone, P. Eckold, R. Theresia, V. Verdingovas, R. Ambat, “Implementation of electrochemical impedance spectroscopy (EIS) for assessment of humidity induced failure mechanisms on PCBAs”, Proceedings of EUROCOR 2018, Krakow, Poland. 
F. Li, V. Verdingovas, K. Dirscherl, B. Medgyes, R. Ambat, “Corrosion Reliability of Lead-Free Solder Systems Used in Electronics”, Proceedings of Nordic Conference on Microelectronics Packaging, Nordpac 2018, Oulu, Finland 2018.
K. Piotrowska, M. Jellesen, R. Ambat, “Water film formation on the PCBA surface and failure occurrence in electronics”, Proceedings of Nordic Conference on Microelectronics Packaging, Nordpac 2018, Oulu, Finland 2018. 

R. Ambat, V. Verdingovas, and P. Eckold, “Impedance spectroscopic analysis of water layer formation on PCBA surface leading to sequential corrosion failures”, 11th International Symposium on Electrochemical Impedance Analysis 6-10 November 2017, Camogli (Genova), Italy.
F. Li, V. Verdingovas, B. Medgyes, R. Ambat, “Corrosion Reliability of Lead-free Solder Systems Used in Electronics”, Proceedings of the European Corrosion Congress (Eurocorr 2017), Prague.
B. Medgyes, S. Ádám, L. Tar, V. Verdingovas, R. Ambat, G. Harsányi, “Electrochemical migration of lead-free solder alloys in Na2SO4 environment”, Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), Sofia, Bulgaria, 2017, pp.

R. Ambat, H. Conseil, “Improving intrinsic corrosion reliability of printed circuit board assembly”, Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC), Singapore, 2016, pp. 540-544.
S. Mohanty, Z. Staliulionis, P. Nasirabadi, R. Ambat, J. Hattel, “Optimization of electronic enclosure design for thermal and moisture management using calibrated models of progressive complexity”, Proceedings of the 18th Electronics Packaging Technology Conference (EPTC), Singapore, 2016, pp. 483-487.
Z. Staliulionis, S. Joshy, R. Ambat, M. Jabbaribehnam, S. Mohanty, J. Hattel, “Analysis of moisture transport between connected enclosures under a forced thermal gradient”,Proceedings of the 18th Electronics Packaging and Technology Conference (EPTC), Singapore, 2016, pp. 320-324.
P. Nasirabadi, H. Conseil-Gudla, S. Mohanty, M. Jabbari, R. Ambat, J. Hattel, “Semi-Empirical Prediction of Moisture Build-up in an Electronic Enclosure Using Analysis of Variance (ANOVA)”, Proceedings of the 18th Electronics Packaging Technology Conference (EPTC), 2016, pp. 785-790.
R. Ambat, “An overview on the corrosion reliability of electronics”, Proceedings of the European Corrosion Congress, Eurocorr 2016, Montpellier, France.
V. Verdingovas, M.S. Jellsen, R. Ambat, “Characterization of humidity effects on electronics by impedance spectroscopy”, Proceedings of the European Corrosion Congress, Eurocorr 2016, Montpellier, France.
L. D’Angelo, V. Verdingovas, L. Ferrero, E. Bolzacchini, R. Ambat, “Effect of hygroscopic atmospheric particles deposition on the corrosion reliability of electronics”, Proceedings of the European Corrosion Congress, Eurocorr 2016, Montpellier, France.
V. C. Gudla, R. Bøttzauw, M. S. Jellesen, R. Ambat, “Corrosion Failure Analysis of Hearing Aid Battery Contacts”, Proceedings of the European Corrosion Congress, Eurocorr 2016, Montpellier, France. 
H. Conseil, G. Hamm, L. Müller, M. Hain, R. Ambat, “Dynamics of moisture ingress in first and second and first level housings”, Proceedings of the European Corrosion Congress, Eurocorr 2016, Montpellier, France.
M.S. Jellesen, V. Verdingovas, H. Conseil, R. Ambat, “Electronics device level testing and visualization of tin corrosion on analysis of printed circuit boardscorrosion”, Proceedings of the European Corrosion Congress, Eurocorr 2016, Montpellier, France.
P. Jensen, V.C. Gudla, R.Ambat, “Thermal stability of tin-nickel alloy: Study on microstructure and electrochemical properties”, Proceedings of the European Corrosion Congress, Eurocorr 2016, Montpellier, France.

EC2015 Piotrowska et al - (Contamination, potential bias and humidity effects on electrical performance and corrosion reliability of electronic devices)

EC2015 Jellesen et al - (Sulphur induced corrosion of electronics)

EC2015 Conseil et al - (Experimental study of humidity distribution inside electronic enclosure and effect of interanl heating)

EC2014 Piotrowska et al - (Corrosion reliability of electronics the influence of solder temperature on the decomposition of flux activators)

EC2014 Conseil et al - (Contamination profile of printed circuit board assemblies in relation to soldering types and conformal coating)

EC2014 Ambat et al - (Perspectives on the climatic reliability issues of electronic devices)

EC2013 Verdingovas et al - (Impact of hygroscopicity and composition of solder flux residue on the reliability of PCBA under corrosive conditions)

EC2013 Jellesen et al (Printed circuit board surface finish and effects of chloride contamination, electric field, and humidity on corrosion reliability)

EC2013 Conseil et al - (Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics)

EC2013 Ambat et al - (An overview on the climatic reliability issues of electronic devices)

EC2012 Verdingovas et al (Effect of ionic contamination on climatic reliability of printed circuit board assemblies)

2012IMAPS Ambat - (Perspectives on climatic reliability of electronic devices and components)

EC2011 Rathinavelu et al - (Effect of process related residues on the performance of conformal coatings for PCBA applications)

EC2010 Elisseeva et al - (A local electrochemical approach to study corrosion in plastic encapsulated semiconductor devices)

EC2009 Rathinavelu et al - (Performance of conformal coatings on electronic printed circuit boards under harsh environmental conditions)

EC2009 Ambat et al - (Solder flux residues and electrochemical migartion failures of electronic devices)

EC2008 CELCORR poster

EC2008 Minzari et al - (Electrolytic migration on electronic chip resistors in chloride environments)

EC2008 Jellsen et al - (Corrosion in electronics)

2008RAMS Stentoft et al - (Electronics in harsh environments - product verification and validation)